Cyient DLM IPO: Check Issue Date, Price, Lot Size & Details | Espresso

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Cyient DLM Limited IPO Opens on June 27. Check IPO Details Issue Date Price

June 26, 2023
Cyient DLM Limited IPO Opens on June 27. Check IPO Details Issue Date Price

Cyient DLM Limited is coming out with a fresh public issue to raise Rs. 592 crores from the market.

Below are the details of the Cyient DLM Limited IPO:

  • Issue opens – June 27 (Tuesday)
  • Issue closes – June 30 (Friday)
  • Issue size – Rs. 592 crores
  • Price band – Rs. 250 to 265 per equity share
  • Bid lot – 56 shares and in multiples thereof.

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And here are some details of the company and further details on the Cyient DLM Limited IPO.

Company details:

  • Cyient DLM Limited (“Cyient DLM”) was incorporated on June 30, 1993. Promoted by Cyient Limited, Cyient DLM is one of the leading integrated Electronic Manufacturing Services (“EMS”) and solutions providers with strong capabilities across the value chain and the entire life cycle of a product. Cyient DLM is a qualified supplier to global OEMs in the Aerospace and Defence, Medical Technology and Industrial sectors. ‘Low volume, high mix’ (LVHM) is a type of contract manufacturing setup which typically has a very high emphasis on quality and customization which changes according to the requirements of the customer. They have over 22 years of experience in developing high mix, low-to-medium volume highly complex system.
  •  Their EMS are provided as Build to Print (“B2P”) and Build to Specification (“B2S”) services to their clients. Company’s B2P solutions involve their client providing the design for the product for which they provide agile and flexible manufacturing services. Their B2S services involve utilising their Promoter’s design capabilities to design the relevant product based on the specifications provided by the client and manufacturing the product. Their solutions primarily comprise: (i) printed circuit board (“PCB”) assembly (“PCBA”), (ii) cable harnesses, and (iii) box builds which are used in safety critical systems such as cockpits, inflight systems, landing systems, and medical diagnostic equipment.  
  • Company’s cable harnesses solutions involve the process of assembly of electrical cables or wires.
  • The company assembles box builds - also known as systems integration, box builds can be anything from a simple PCBA housed in a small enclosure, to a cabinet housing a complex electromechanical system, ranging from very simple to complex devices with a wide range of applications.
  • Cyient DLM also offers several value added and after-market services to their customers, such as obsolescence management, new product introduction, value engineering, sustenance engineering and logistics and supply chain management.
  • Cyient DLM enjoy long-term relationships as an integrated partner to multiple marquee customers such as Honeywell International Inc. (“Honeywell”), Thales Global Services S.A.S (“Thales”), ABB Inc, Bharat Electronics Ltd and Molbio Diagnostics Pvt Ltd, having had an average relationship of over 11 years as on March 31, 2023.
  • Company’s manufacturing infrastructure comprises 3 facilities spread across 2 States in India, at Mysuru, Hyderabad and Bengaluru, with a total manufacturing area of 229,061 sq. ft.

Issue Size:

Rs. 592 crores

Net Issue break-up:

  • QIB – 75% of the offer – Rs. 432.75 crores
  • NIB – 15% of the offer – Rs. 86.55 crores
  • RET – 10% of the offer – Rs. 57.70 crores

Employees Reservation:

Equity Shares aggregating up to Rs. 15 crores

Employees Discount:

Rs. 15/- per share

Listing:

BSE and NSE

Registrar:

KFin Technologies Limited

UPI:

All Retail & NII bidders' (bids up to Rs. 5,00,000) applications through brokers are compulsorily in UPI Mode.

Note:

  • Application made using third party UPI or ASBA Bank A/c are liable to be rejected. 
  • The UPI Mandate acceptance time for Retail and NII Bidders (bids up to Rs. 5,00,000) shall expire at 5:00 PM on the closing day of the IPO i.e. Friday, June 30, 2023     

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